Box clamps are an optimal solution for the secure mounting of small-format press-pack semiconductors with single-sided thermal dissipation. 

These systems are ideal for applications requiring uniform pressure to ensure optimal contact between the semiconductor and the heat sink, improving the device's reliability and performance.

• Specifically designed for small-format press-pack semiconductors.
• Plastic for added protection and enhanced safety.
• Uniform pressure application to improve thermal conduction and electrical contact.
• Easy installation and reliable mounting in power electronics systems.
• Suits devices up to 50mm in diameter with 25mm height.
• Size: 66(74.75) x 66 x 66.5mm